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Job Family: Software

Req ID: 489807

Siemens EDA is a global technology leader in Electronic Design Automation products and systems. Our portfolio enables companies around the world to develop new and highly innovative electronic products faster and more cost-effectively. Our customers use our solutions to push the boundaries of technology and physics to deliver better products in the increasingly complex world of chip, board and system design.

Siemens EDA is seeking a senior level, self-starting, motivated, and high performing individual for an opportunity to serve as the package design lead in our 3D IC Solutions Engineering team in driving the development of comprehensive, end to end workflow solutions supporting the development of advanced 2.5 and 3D System in Package (SIP) designs. These multi-domain workflow solutions seamlessly integrate Siemens’ industry leading EDA and MCAD tools that facilitate the architectural planning, physical design/verification, muti-die based electrical, thermal, mechanical stress analysis and manufacturing test of advanced 2.5 and 3D System-in-Package (SIP) designs.

Responsibilities

The primary responsibility for this position will be to drive the development of workflows to support the physical design planning, layout, and verification of advanced 3D IC designs. These workflows include package floor planning, package/chiplet level functional/ IO planning, interposer/substrate planning, layout, package level connectivity, Logical Equivalence Checking (LEC), package level 3D stack (DRC/LVS) verification and physical DRC/DFM verification of the package components (excluding the chiplet devices). Additional responsibilities include working with the 3D IC Solutions teams in integrating the other 3D IC workflows into the 3D IC Physical Design workflow.

Reference designs and test structures and/or customer designs will be used in the development, testing and validation of these workflows. The package design lead will also provide technical support and guidance to the sales, marketing design service organizations as required.

This position may require periodic travel to work with customers in developing and validating these workflow solutions.

Requirements

• BS or MS in Electrical/Computer Engineering - or equivalent

• Advanced package physical design and verification experience

• Working knowledge (experience preferred) of Advanced Packaging IC EDA tools and design methods including:

• 2.5D and 3D solutions (Si Interposer, FOWLP Package and Interposer, Organic Package)

• Package Design Cadence (APD/SiP), Siemens (XSI/XPD)

• Signal/Power integrity analysis: Siemens (HyperLynx SI/PI), Ansys (Redhawk, Totem, Swave), Cadence (Sigrity,Clarity)

• Detailed knowledge of EDA data formats (Verilog, LEF/DEF, GDS, OASIS, etc.).

• Working OS knowledge of Windows and Linux

• Scripting/Programming: Python, Tcl, Perl, or similar languages required; Tk based GUI development is a plus.

• Working knowledge of IC EDA tools and design methods including:

• ASIC design methodology from RTL Synthesis to Physical Implementation phases

• RTL Design/Verification, LEC, STA analysis

• Integration and validation of Silicon-on-Chip IP integration and validation

• Place and Route solutions: Siemens (Aprisa, Nitro, Tanner), Synopsys (IC/3DIC/Custom Compiler), Cadence (SoC Encounter, Innovus, Virtuoso)

• Physical Verification: DRC, LVS, IR/EM analysis

• DFT integration and ATE test support.

• Working knowledge of Thermal/Stress analysis and/or optical design tools and design methods a plus, including:

• Thermal and/or mechanical stress analysis tools:Siemens (NX, Flowtherm,SimCenter 3D), Ansys (Icepak, Mechanical), Cadence (Celsius)

• Optical design/analysis tools:Siemens (Tanner), Ansys (Lumerical)

• Working competency with Microsoft Word, Excel, and PowerPoint.

Why us?

Working at Siemens Software means flexibility - Choosing between working at home and the office at other times is the norm here. We offer great benefits and rewards, as you'd expect from a world leader in industrial software.

A collection of over 377,000 minds building the future, one day at a time in over 200 countries. We're dedicated to equality, and we welcome applications that reflect the diversity of the communities we work in. All employment decisions at Siemens are based on qualifications, merit, and business need. Bring your curiosity and creativity and help us shape tomorrow!

The total cash compensation range for this position is $150,100 to $270,200 with 15% of this being comprised of an annual incentive target. The actual compensation offered is based on the successful candidate’s work location as well as additional factors, including job-related skills, experience, and relevant education/training. Siemens offers a variety of health and wellness benefits to employees. Details regarding our benefits can be found here: www.benefitsquickstart.com In addition, this position is eligible for time off in accordance with Company policies, including paid sick leave paid parental leave, PTO (for non-exempt employees) or non-accrued flexible vacation (for exempt employees).

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150100 270200 15

Organization: Digital Industries

Job Type: Full-time

Category: Research & Development