Job Information
Texas Instruments [Experienced] Senior Wirebond Equipment Engineer (Melaka, MYS) in Melaka, Malaysia
Change the world. Love your job.
Do you want to work for an organization that values your opinion? Do you want to work for an organization where you can play a pivotal role in several different areas? Look no further. As a Texas Instruments Wire Bond Equipment Engineer, you will have the opportunity to work in a vibrant and dynamic team oriented environment.
Responsibilities include:
Evaluating, selecting, and ordering equipment that is most appropriate and cost effective for the manufacture of company products
Overseeing the installation, modification, upgrade and maintenance of manufacturing equipment
Keeping current on equipment manufacturers' technical notices, upgrades and safety issues
Studying equipment performance and reliability
Establishing programs and solutions for increasing uptime and for equipment problems that affect the manufacturing process
Providing technical support to the manufacturing equipment repair and process engineering organizations
Defining and writing preventative maintenance schedules
Why TI?
Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics.
We're different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours. Meet the people of TI (https://edbz.fa.us2.oraclecloud.com/hcmUI/CandidateExperience/en/sites/CX/pages/4012)
Benefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life. Your well-being is important to us.
About Texas Instruments
Texas Instruments Incorporated (Nasdaq: TXN) is a global semiconductor company that designs, manufactures and sells analog and embedded processing chips for markets such as industrial, automotive, data center, personal electronics and communications equipment. At our core, we have a passion to create a better world by making electronics more affordable through semiconductors. This passion is alive today as each generation of innovation builds upon the last to make our technology more reliable, more affordable and lower power, making it possible for semiconductors to go into electronics everywhere. Learn more at TI.com .
Texas Instruments is an equal opportunity employer and supports a diverse, inclusive work environment.
If you are interested in this position, please apply to this requisition.
Minimum Requirements:
Bachelor degree of electronics or electrical engineering, Mechanical Engineering, or related engineering degree
Minimum 3 years as Wire bond Equipment Engineer with KNS and ASM wire bond equipment maintenance experience in semiconductor manufacturing operations
Equipped with Wire bond process experiences will be added advantage
Work Arrangement: Full-time, onsite role based at Texas Instruments Malaysia, Batu Berendam, Malacca.
Preferred Qualifications:
Equipment experience with Wire bond process, must be able to hand on KNS and ASM wire bond machine
Prior experience with Gold/Cu/PCC wire & Bump ball process bonding
Equipment experience on other equipment post wire bond process (e.g., plasma, Die coat)
Experience on tool monitoring and interdiction software, and equipment maintenance and documentation
Working knowledge of semiconductor manufacturing, and SPC/Spotfire techniques. Experienced with semiconductor cleanroom protocol and behaviors.
Strong verbal and written communication skills
Demonstrated strong analytical, critical thinking and problem solving skills
Ability to work in teams and collaborate effectively with people in different functions
Ability to take the initiative and drive for results
Strong time management skills that enable on-time project delivery
Ability to work effectively in an interrupt-driven, fast-paced and rapidly changing environment
Demonstrated ability to build strong, influential relationships
ECL/GTC Required: Yes