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We’re at the forefront of an exciting era of semiconductor innovation at Texas Instruments’ LFAB in Lehi, Utah — home to our state-of-the-art 300mm manufacturing facility now ramping our most advanced 28nm analog and embedded process technology in the heart of the Silicon Slopes. As part of our Advanced Technology Development (ATD) organization, you will be challenged with developing and characterizing the next generation node. We are seeking a highly skilled and hands-on Process Development Engineer with deep expertise in advanced-node semiconductor manufacturing. This role focuses on the next generation 20nm-class logic technologies, with primary responsibility for photolithography and litho-etch integration, including advanced patterning techniques such as pitch doubling (SADP/LELE). This role will also work directly with the Resolution Enhancement Techniques (RET) team to create Optical Proximity Corrections (OPC) and validate final pattern meets design tolerance.

You will play a critical role in developing, optimizing, and scaling patterning processes to meet aggressive performance, yield, and manufacturability targets. This is a high-impact position working at the intersection of lithography, materials science, and plasma etch.

Responsibilities include:

• Modeling & Simulation: Utilize lithography simulation software (e.g., Prolith, S-Litho) to analyze process windows and optimize patterning results.

• Metrology & Yield Improvement : Utilize advanced metrology (CD-SEM, Overlay, Scatterometry) to identify defects and improve Critical Dimension Uniformity (CDU) and overlay performance.

• Vendor & Subsystem Interaction: Work with equipment vendors to evaluate new materials, photoresists, and tool hardware upgrades.

• Data Analysis & SPC: Analyze process data, identify root cause, and implement robust process improvements. Apply Statistical Process Control (SPC) and Design of Experiments (DOE) to develop new processes to enable Litho shrink processes.

• Pathfinding & Technology Transfer: Define pathfinding activities for new patterning technology, evaluating High NA Immersion for next-generation nodes. Lead technology transfer from R&D to HVM for photolithography processes.

• Photo Process Characterization: Lead development to create next generation Litho Shrink processes for 20nm class logic nodes.

• Drive litho-etch integration (LE, LELE, SADP / pitch doubling) for advanced patterning schemes.

• Develop and implement resolution enhancement techniques (RET) and optical proximity correction (OPC)strategies.

• Evaluate and select materials systems, including photoresists, hard masks, and anti-reflective coatings.

• Characterize and reduce patterning defects, including line edge roughness (LER), CD variation, and overlay errors.

• Collaborate closely with Etch team to optimize pattern transfer, profile control, and CD uniformity Interface with cross-functional teams including design, integration, yield, and manufacturing.

Why TI?

• Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics.

• We're different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours. Meet the people of TI (https://edbz.fa.us2.oraclecloud.com/hcmUI/CandidateExperience/en/sites/CX/pages/4012)

• Benefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life. Your well-being is important to us.

About Texas Instruments

Texas Instruments Incorporated (Nasdaq: TXN) is a global semiconductor company that designs, manufactures and sells analog and embedded processing chips for markets such as industrial, automotive, data center, personal electronics and communications equipment. At our core, we have a passion to create a better world by making electronics more affordable through semiconductors. This passion is alive today as each generation of innovation builds upon the last to make our technology more reliable, more affordable and lower power, making it possible for semiconductors to go into electronics everywhere. Learn more at TI.com .

Texas Instruments is an equal opportunity employer and supports a diverse, inclusive work environment. All qualified applicants will receive consideration for employment without regard to race, color, religion, creed, disability, genetic information, national origin, gender, gender identity and expression, age, sexual orientation, marital status, veteran status, or any other characteristic protected by federal, state, or local laws.

If you are interested in this position, please apply to this requisition.

Minimum requirements:

• Master's in Electrical Engineering, Materials Science, Physics, or related discipline

• 5+ years of industry experience in advanced semiconductor process development

• Direct, hands-on experience with 22nm node or comparable advanced nodes (e.g., 28nm, 14nm)

• Strong expertise in:

• Photolithography process development and optimization

• Litho-etch integration (LELE, SADP, pitch splitting/doubling)

• OPC and Resolution Enhancement Techniques (RET) methodologies

• Dry etch processes for pattern transfer

• Deep understanding of:

• Critical dimension (CD) control and uniformity

• Overlay and alignment challenges

• Defectivity mechanisms and mitigation strategies

Preferred qualifications:

• PhD in Electrical Engineering, Materials Science, Physics, or related discipline

• Experience with self-aligned multiple patterning (SAMP, SADP, SAQP)

• Familiarity with advanced nodes below 22nm (e.g., 16/14nm FinFET technologies)

• Experience working in high-volume manufacturing environments (foundry or IDM)

• Exposure to industry-standard modeling and OPC tools

• Strong problem-solving skills with a data-driven approach

• Demonstrated ability to work cross-functionally in fast-paced environments

• Experience with advanced reticle layout and Resolution Enhancement Techniques (RET)

• Demonstrated strong analytical and problem-solving skills, with a collaborative team-player mindset

• Technical Skills: Deep understanding of Immersion lithography, DUV, and multi-patterning processes. Demonstrated ability to Design for Manufacturing

• Software Skills: Proficiency with lithography simulation software (ProLith, S-Litho) and data analysis tools (e.g., JMP, Python)

ECL/GTC Required: Yes