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Senior Structural Modeling & Simulation Engineer

At HP, we exist to amaze-through the people we hire, the experiences we enable, and ultimately the technology we create. We invent, develop, and bring to market new technologies and capabilities and integrate them into our products. The R&D initiatives in our state-of-the-art microfluidics and MEMS lab are based on HP's long history in print, where we pursue adjacent technologies with an eye toward consumer and industrial applications. Applications include life science, industrial print, precision dispense next-gen thermal control and more. We provide advanced innovative solutions to our partners and customers, both internal and external.

Responsibilities:

As an EMAG (Engineering Modeling and Analysis Group) Senior Structural Modeling Engineer, you will work as an integral part of the broader team. You will lead simulation-first design efforts across the organization by developing and running simulation models to uncover fundamental insights and expedite design cycles. EMAG is responsible for the development of predictive and diagnostic computational modeling methods in new technology and product development.

Required Skills:

• M.S./Ph.D. in Mechanical Engineering, Mathematics, Physics, or related fields

• 10+ years of Finite Element Analysis (FEA) experience using ABAQUS or equivalent tools, including experience with:

• Advanced material properties (hyperelastic, orthotropic, phase change, etc.)

• Solver selection (explicit vs. implicit, etc.)

• MEMS (micro-electro-mechanical systems)

• CTE (coefficient of thermal expansion) driven component deformation

• 5+ years of meshing experience (HyperMesh or similar)

• 5+ years of experience with programming/scripting languages (Python, C++, etc.) to build custom analysis tools and procedures

• Ability to lead a cross-functional team with a simulation-first mindset

• Demonstrated experience using experimental and FEA best practices to validate simulation results and improve confidence in models

• Ability to work effectively on a globally distributed team

• Strong project management skills

• Strong analytical and problem-solving skills

• Demonstrated learning agility and strong teamwork

• Excellent oral and written English communication skills

Desired Skills:

• Knowledge of materials engineering and experience in material characterization for FEA

• Experience with advanced electronic packaging and sub-modeling

• Experience solving in frequency and time domains

• Experience with optimizing simulation setup for high performance computing clusters

• Knowledge of optimization tools and techniques including topology optimization

• Experience with data manipulation

• Leadership and mentoring experience

The pay range for this role is $116,150.00 to $182,400.00 USD annually with additional

opportunities for pay in the form of bonus and/or equity (applies to United

States of America candidates only). Pay varies by work location, job-related

knowledge, skills, and experience.

Benefits:

HP offers a comprehensive benefits package for this position, including:

• Health insurance

• Dental insurance

• Vision insurance

• Long term/short term disability insurance

• Employee assistance program

• Flexible spending account

• Life insurance

• Generous time off policies, including;

• 4-12 weeks fully paid parental leave based on tenure

• 11 paid holidays

• Additional flexible paid vacation and sick leave (US benefits overview

[https://hpbenefits.ce.alight.com/])

The compensation and benefits information is accurate as of the date of this

posting. The Company reserves the right to modify this information at any time,

with or without notice, subject to applicable law.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, or status as a protected veteran.